Chip Quik Lead-Free No-Clean T3 Solder Paste (10cc)

• Alloy: Sn96.5/Ag3.0/Cu0.5
• Flux Type: Synthetic No-Clean
• Flux Classification: REL0
• Metal Content: 87% metal by weight.
• Particle Size: T3 (25-45 microns)
• Melting Point: 217-220C (423-428F)
• Size: 10cc/35g syringe

• Refrigerated >6 months, unrefrigerated >2 months

• >8 hours @ 20-50% RH 22-28C (72-82F)
• >4 hours @ 50-70% RH 22-28C (72-82F)

Stencil Cleaning
Automated stencil cleaning systems for both stencil and misprinted boards. Manual cleaning using isopropyl alcohol (IPA).

Storage and Handling
Refrigerate at 3-8C (37-46F). Do not freeze. Allow 4 hours for solder paste to reach an operating temperature of 20-25C (68-77F) before use.

Documents

• Datasheet
• MSDS Sheet